By Antone Gonsalves
InformationWeek
Samsung unveiled a
multi-chip memory package that it claims is the
thinnest ever, for smartphones, portable media players, laptops and other mobile electronics.
The package measures just 0.02 of an inch thick and packs
32 GB of storage. The device is 40% thinner and lighter than a conventional memory package, according to the vendor.
The new device features a significantly thinner "bare" die, or chip, that measures half the thickness of a conventional die, Samsung said. The package comprises eight stacked NAND flash chips, built using a 30-nanometer production process.
In developing the super-thin dies, Samsung said it overcame the limits of conventional technology that led to an unacceptable drop in production yields when chips were less than 30 micrometres thick. The new dies are half that amount and will double the storage capacity in the same size memory package used today.
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