US Patent Issued to Science Research Laboratory on Feb. 19 for "Method for Bonding of Semiconductor Component to a Substrate" (Massachusetts Inventors)
ALEXANDRIA, Va., Feb. 26 -- United States Patent no. 8,377,797, issued on Feb. 19, was assigned to Science Research Laboratory Inc. (Somerville, MassMethod for Bonding of Semiconductor Component to a Substrate" was invented by Aland K. Chin (Sharon, Mass Jonah H. Jacob (Brookline, Mass.) and Maciej ... (Publication: US Fed News Service, Including US State News)
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US Patent Issued to Science Research Laboratory on Feb. 19 for "Method for Bonding of Semiconductor Component to a Substrate" (Massachusetts Inventors)Linkback: https://tubagbohol.mikeligalig.com/index.php?topic=69252.0